TSMC will leave again, the head of the open innovation platform will go to Intel | Anue Juheng-Taiwan Stock News

Wafer foundry leader TSMC (2330-TW)(TSM-US) Recently, there have been frequent reports of the departure of the general. Following the appointment of Liu Xiaoqiang, the director of the 12-inch wafer fab in the Tainan fab, as the CEO of Shengweixu, a state-owned DRAM factory in Shenzhen, China, Suk Lee, the former deputy general manager of the design and architecture management department of TSMC in charge of the open innovation platform business, He also resigned in June and moved to Intel (INTC-US)。

Suk Lee has served TSMC for 13 and a half years. Since 2009, he has served as the senior director of the design and architecture marketing department. Since February 2021, he has served as the deputy general manager of the design and architecture management department. Before joining TSMC, he worked in electronic design automation tools (EDA) supply. Shangxinsi Technology, Yihua Computer (CDNS-US), and Deyi (TXN-US) and other semiconductor factories.

Suk Lee used to be responsible for the Open Innovation Platform (OIP) related business at TSMC. He recently announced on LinkedIn that he has joined Intel as the deputy general manager of ecosystem technology development. He is expected to help Intel strengthen the foundry ecosystem with years of experience in the open innovation platform. development, thus attracting market attention.

Intel is actively expanding the foundry service (IFS) ecosystem, and recently announced plans for the next phase of the accelerator ecosystem, establishing the IFS cloud alliance to achieve a secure design environment in the cloud, improve customer design efficiency, and accelerate time-to-market. Initial members Including cloud providers Amazon Web Services and Microsoft Azure, and cooperation with major electronic design automation (EDA) players such as Ansys, Yihua Computer, Siemens EDA and Synopsys.


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