There will be updates to improve the performance of the Ryzen 9000 series. Increase processing performance by improving TDP and reducing delay between cores

On September 30, 2024, North American time, AMD announced on its official blog that it is a CPU for desktop PCs.Ryzen 9000We have released information on updates that have been implemented for the “ series to improve performance. This is a summary of information that has been released so far, so if you are an AMD fan who has been checking information on the Ryzen 9000 series frequently, there are no new updates, but let’s give a quick summary.

Two notable updates in AGESA PI 1.2.0.2

Firmware for the Ryzen series, which has already begun to be distributed as a UEFI update on some AM5 compatible motherboards.AGESA PI 1.2.0.2”, two major performance improvements were made.

One is “Ryzen 7 7900X” and “Ryzen 5 9600X”, TDP (Thermal Design Power, thermal design power consumption) settingsMaximum 105WIt means raising it up to. Ryzen 7 7900X and Ryzen 5 9600X at the time of their release had a TDP of 65W. However, according to AMD, the Ryzen 7 7900X and Ryzen 5 9600X have been tested and shipped at a TDP of 105W, so AMD has acknowledged that even a significantly higher TDP is within the warranty.

Setting the TDP to 105W will improve performance by up to 10%. Although it comes at the expense of power consumption and heat, this is a welcome update for users who want to prioritize performance. However, AMD cautions that users who use the 105W setting should “use a heat dissipation system that can handle that heat output.”

By setting TDP to 105W, performance can be improved by up to 10% compared to conventional models.

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The second update is to reduce inter-core latency for the Ryzen 9 9950X and Ryzen 9 9900X, which are equipped with two CPU Complex Dies (hereinafter referred to as CCDs).

According to AMD, the Ryzen 9000/7000 series has a “corner case” (a rare case that occurs under special circumstances) where two transactions are required to read and write memory, and as a result, compared to previous Ryzen It is said that the latency between cores had increased slightly.
AMD’s development team worked to improve this problem and succeeded in reducing transactions. It seems that the results have been incorporated into AGESA PI 1.2.0.2.

However, according to AMD, this improvement has almost no impact on applications. Especially for games, models equipped with two CCDs use core parking to reduce latency by keeping one CCD inactive. Therefore, it can be easily assumed that reducing the latency between CCDs will have little effect.
However, even for games, some titles such as “Metro Exodus,” “Starfield,” and “Borderlands 3” cannot use core parking because they drive a large number of threads, and benchmark tests such as 3DMark’s “Time Spy.” AMD says that there will be a slight performance improvement due to reduced inter-core latency. By the way, in the Ryzen 9000 series test conducted by 4Gamer, it was confirmed that Starfield’s frame rate seems to increase depending on the number of executable threads. This trend was not a mistake.

AGESA PI 1.2.0.2 reduces inter-core latency for two CCD models

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According to AMD’s explanation, it seems likely that the Ryzen 7000 series models with two CCDs will have reduced inter-core latency. However, in the materials I have, the description of performance improvement is limited to Ryzen 9000. Therefore, the impact on the Ryzen 7000 series is currently unknown. Ryzen 7000 series users may want to test it out.

Supports DDR5-8000 EXPO Memory on motherboards with AMD 870E

Sales of motherboards equipped with the new chipsets “AMD 870E” and “AMD X870” announced along with the Ryzen 9000 series have started.
The difference between AMD 870E and AMD X870 is the number of PCI Express (PCIe) and USB 3.x lanes. For example, the AMD 870E has a total of 44 PCIe lanes, but the AMD 870 has only 36 lanes. However, the number of PCIe 5.0 lanes is the same for both, 24, so the AMD 870 has fewer PCIe 4.0 lanes.

A slide summarizing the main specifications of the current chipset for Ryzen

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As announced at the time of the release of the Ryzen 9000 series, the AMD 870E will be compatible with “AMD EXPO Memory” which can be set to DDR5-8000, which is scheduled to be released by a new memory module manufacturer. According to AMD, by using DDR5-8000 Expo Memory, memory latency can be reduced by about 1 to 2 ns, making it possible to improve latency-sensitive game performance.

AMD summarizes that Expo Memory, which supports DDR5-8000, is not aimed at general gamers, but is the best option for enthusiasts and overclockers. In other words, Expo Memory compatible with DDR5-8000 will be expensive immediately after its release. If you’re a gamer who pursues ultimate performance, it’s probably worth paying attention to.

Is the performance improvement after the release of Ryzen 9000 a break for now?

Although it is becoming a bit old news, there is an update program for Windows 11 that includes optimization for branch prediction of the Ryzen 9000 series.KB5041587” was released by Microsoft on August 27th. The update that includes this optimization is included in Windows 11 “23H2 build 22631.4112” or later or “24H2 build 26100.1301” or later, and if you regularly perform Windows Update, it should have already been automatically installed. .

Branch prediction optimization is already distributed via Windows Update

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By optimizing branch prediction, performance can be improved by up to 10%, and together with AGESA PI 1.2.0.2, it can be said that the Ryzen 9000 series has achieved a significant performance improvement. After that, AMD announced a summary of those updates, which probably means that updates have come to a halt for the time being.
The company is now ready to take on the next generation of CPUs for desktop PCs that Intel is expected to introduce in the near future.

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