2023-11-13 05:57:00
Samsung Electronics is evaluating the adoption of 3D chip technology for its Exynos mobile application processors (APs), according to an internal official. The company sees substantial benefits from this approach, which involves the use of chiplets, an advanced packaging technique. Chiplets are semiconductors with distinct functions that are connected vertically on a single chip, providing advantages over conventional monolithic methods.
One of the main advantages is the improvement in performance. In a monolithic chip, if a problem occurs in a specific circuit, the entire chip must be discarded. With chiplets, only the affected component needs to be replacedresulting in greater efficiency and less waste.
Additionally, chiplets facilitate design changes, making the process more efficient. While in a monolithic chip any modification requires reviewing the entire design, with chiplets, only the specific circuit that needs to be changed needs to be redesigned.
This strategic shift comes at a time when Samsung faces intensified competition in the mobile processor market.
Qualcomm leads, followed by Apple and MediaTek, while Samsung’s Exynos APs face challenges in gaining prominence. The adoption of 3D chiplets can be a crucial differentiator, enabling package size reduction, increased bandwidth and energy efficiency. These improvements could make Exynos APs more competitive compared to offerings from Qualcomm and Apple.
It is worth noting that Samsung is not alone in this trend, as companies such as NVIDIA, AMD and Intel are also exploring the use of chiplets in semiconductors for high performance computing (HPC).
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