2023-07-21 12:16:00
Samsung may start supplying memory chips and other components for NVIDIA’s chip production, according to a report released this Friday (21) by The Elec. The American manufacturer, which is at the forefront of artificial intelligence, would be negotiating with the South Korean giant to add it to its supply chain.
Industry sources claim that Samsung would provide HBM3, a type of memory that offers high density and high bandwidth. The company would also be in charge of manufacturing 2.5D semiconductor packages, that is, the physical structure that interconnects all the logic matrices and protects them from the external environment.
The information is revealed in a possible scenario of demand above supply. TSMC, NVIDIA’s current supplier of semiconductor packaging solutions, appears to be struggling to meet orders from its customers, who are also vying for foundry chips with 3-nanometer lithography for 2023 and 2024.
To ensure that the production of its artificial intelligence accelerators is not hampered, especially in view of the new partnerships for the segment, NVIDIA would be evaluating the possibility of counting on the supply of Samsung’s I-Cube 2.5D package, capable of housing up to four HBM units on an extremely thin substrate.
In the memory department, SK Hynix is responsible for supplying HBM3 to NVIDIA. Samsung would add to this chain by providing memories capable of reaching speeds of up to 6.4 GB/s — faster than rival solutions — while having lower power consumption.
AMD, which competes directly with NVIDIA with its new Instinct MI300 accelerators, is one of the companies benefiting from Samsung’s HBM3 memories.
According to people familiar with the matter, the factor that will determine the elaboration of an agreement between the companies is the quality of Samsung’s memory chips, which must meet NVIDIA’s quality requirements.
This could be a new way to increase Samsung’s share of the market for semiconductors and AI chips. The manufacturer appears to be working on a new strategy that targets current weaknesses in TSMC’s production capabilities to take part of its market share throughout 2023.
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