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Samsung Electro-Mechanics[009150]It is known that Apple is pushing to supply a semiconductor package substrate (FC-BGA) to Apple’s next-generation PC processor ‘M2’.
According to the industry on the 21st, Samsung Electro-Mechanics is reported to be collaborating on the PC processor M2 development project developed by Apple.
Apple is currently developing new PC products such as a notebook MacBook equipped with an M2 processor, and Samsung Electro-Mechanics is developing a semiconductor package board, a core part of the processor, in line with the release schedule.
The semiconductor package board is a component that connects the high-integration semiconductor chip and the main board to transmit electrical signals and power.
The flip-chip-ball grid array (FC-BGA), which Samsung Electro-Mechanics focuses on, is a highly integrated semiconductor package substrate with the highest manufacturing difficulty. applies.
Previously, Samsung Electro-Mechanics was reported to have supplied FC-BGA substrates to Apple’s first PC processor ‘M1’ in 2020.
Samsung Electro-Mechanics invested 1.3 trillion won in Vietnam in December last year to build FC-BGA production facilities and infrastructure, and last month invested an additional 300 billion won to expand the FC-BGA plant in Busan.
Samsung Electro-Mechanics, which started the substrate business in 1991, is the No. 1 company in the field of semiconductor package substrates for flagship mobile applications (AP).
Samsung Electro-Mechanics only said, “We cannot confirm the contents related to the customer,” regarding the supply of Apple’s semiconductor package substrate.
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