Qualcomm (QCOM-US) released new products on the 15th. According to South Korean media The Elec, Chief Marketing Officer Don McGuire revealed that TSMC (TSM-US) (2330-TW) foundry, but following entering the GAA process, it is possible to adopt the dual-supplier strategy of simultaneously placing orders for Samsung and TSMC.
Qualcomm’s Snapdragon 8 Gen 1 was originally manufactured by Samsung last year, but it began to switch to TSMC in the second half of last year. At that time, the market believed that the main reason for Samsung’s loss of orders was the 4nm process yield, capacity supply and other factors. It is expected that 3nm AP will be manufactured by TSMC in the future. manufacture.
Regarding the order plan for the advanced process following 3nm and 2nm, McGuire said that he will continue to maintain a cooperative relationship with Samsung foundries. As the technology matures, he will cooperate with Samsung, TSMC and other foundries, which means that TSMC will not continue to It will definitely be able to win Qualcomm’s advanced process orders alone.
McGuire said that because Qualcomm’s orders are too large to be manufactured by a single manufacturer, it will maintain a multi-generation factory strategy. The multi-supplier strategy is easier to control in terms of supply, and has advantages in price competitiveness and scale expansion, especially from the company’s When mobile phones expand to other fields, the multi-vendor strategy becomes even more important.
The Elec pointed out that this reveals that Qualcomm’s current order for TSMC will only be a short-term phenomenon. In the future, the maturity of advanced process technology and the output under GAA technology will become the key to determine the cooperative manufacturers. In the future, Samsung’s GAA 3nm production trend will become the focus.
Although Samsung has encountered production problems at 4nm, the 3nm process using GAA technology is progressing rapidly and has entered mass production; while TSMC’s 3nm has been mass-produced, but it uses FinFET technology and is expected to be 2nm. Import GAA technology.
