2023-07-24 22:00:00
Plastronics is developing at the convergence of plastics processing and electronics. This technology consists of functionalizing, using electronics, 3D plastic parts. The applications are numerous and are found in the telecommunications, automotive, aeronautics and medical sectors in particular.
A plastronic device (Molded Interconnect Device, MID or 3D-MID) is an object that incorporates an electrically conductive pattern and integrates mechanical and electronic functions. The conductive tracks are integrated into the 3D object, which allows better interweaving of the different functions (mechanical, electronic, optical, etc.). The advantages are numerous and it is worth highlighting, among the most important, the saving in space and mass due in particular to the integration density.
Several manufacturing methods can be implemented to manufacture a plastronic device. Some have reached a level of maturity allowing their industrialization, such as direct laser structuring (Laser Direct Structuring, LDS). Others are under development. All the methods implemented require an understanding of the chemistry and mechanics of materials, the tools for creating functional devices and the manufacturing processes. Plastronics thus finds itself at the convergence of several complementary disciplines.
The technology presented in this article is an emerging, disruptive process that allows printing directly on thermoplastic objects of any shape. The advantages and limitations linked to the process are presented as well as the potential offered. Examples of functionalized 3D devices show that it is possible, for example, to print functional antennas on half-spheres. In addition, many avenues of development and characterization are still to be explored, particularly with regard to achievable resolutions, the design of 3D circuits, the measurement of electrical properties on 3D devices and the aging of devices.
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