NXP Semiconductors announced that it has been able to utilize Wi-Fi 6 in Honor’s flagship Magic V smartphone through the WLAN7207H 2.4GHz front-end integrated circuit (FEIC). The NXP WLAN7207x single FEM family provides routing and printed circuit board (PCB) design flexibility to enable optimized RF performance in smartphones.
As the functions of smartphones diversify to meet the needs of consumers, the architecture and PCB design difficulty gradually increased. Consumers want more advanced devices that support both Bluetooth and Wi-Fi 6 performance aspects. In other words, a smartphone that satisfies consumers should have improved features compared to the previous generation, such as low latency and high network capacity and efficiency. The WLAN7207x single FEM family provides designers with greater freedom in routing and PCB placement to optimize RF for higher Wi-Fi 6 and Bluetooth performance.
Doeco Terpstra, Vice President and General Manager, Smart Antenna Solutions, NXP said, “As consumers depend on their smartphones to benefit from ever-increasing data-driven benefits, the amount of data that needs to be transmitted and the number of devices increases dramatically. “Wi-Fi 6 is our answer to these challenges. Our FEIC solution provides the Wi-Fi 6 performance benefits consumers want, while providing the design flexibility OEMs need.”
George Zhao, CEO of Honor, said, “As smartphones become more feature-rich, the form-factor has become a differentiator for consumers. With NXP’s FEM solution, the longer “It can overcome the increasing complexity and challenges of flagship phone designs while providing transmission range and improved signal quality.”
