Cooling Down the Heat: NovoLINC’s Breakthrough Thermal Solutions
Table of Contents
- 1. Cooling Down the Heat: NovoLINC’s Breakthrough Thermal Solutions
- 2. NovoLINC Secures Funding to Revolutionize Chip Cooling
- 3. TDK Ventures: A Driving Force in Digital and Energy Conversion
- 4. How does NovoLINC’s nanostructured composite material technology achieve industry-record-low thermal resistance?
In the relentless race for faster, more powerful electronics, heat generation is becoming a major bottleneck. Consider gpus: their power consumption has skyrocketed from 250W a decade ago to a staggering 1,200W for flagship models today. Similarly, CPUs have seen a nearly threefold increase in power consumption between 2019 and 2024.
This surge in heat poses a serious challenge, notably as AI datacenters transition to liquid cooling. Traditional thermal interface solutions simply haven’t kept pace with these demands. Enter NovoLINC, a thermal technology startup spun out of carnegie Mellon university, offering a groundbreaking solution.
NovoLINC’s secret weapon? Unique nanostructured composite materials engineered to achieve industry-record-low thermal resistance. “NovoLINC technology offers outstanding thermal performance for cooling high-power electronics, such as CPUs and GPUs,” state Prof. Sheng Shen and Dr. Rui Cheng, NovoLINC’s CTO. This innovation is poised to revolutionize the way we manage heat in high-performance computing.
The company’s breakthrough has attracted considerable attention, securing seed funding led by M Ventures, with participation from Foothill Ventures and TDK Ventures. NovoLINC’s founders have also received grant funding from the prestigious U.S. National Science Foundation’s Partnerships for innovation and ARPA-E’s COOLERCHIPS Programs, recognizing the immense potential of their technology.
By providing their products to semiconductor companies and hyperscalers, NovoLINC is directly addressing a critical challenge facing the future of computing. As AI and data-intensive applications continue to demand ever-increasing processing power,efficient thermal management will be essential. NovoLINC is positioned to be at the forefront of this crucial advancement.
NovoLINC Secures Funding to Revolutionize Chip Cooling
NovoLINC, a leading innovator in thermal management solutions, has announced a important funding round led by M Ventures, with participation from TDK Ventures and Foothill Ventures. This investment will fuel the company’s mission to develop and commercialize cutting-edge thermal interface materials for high-performance computing, data centers, and other power-intensive applications.
“Efficient thermal interface solutions have become a crucial aspect of data center infrastructure due to the increasing power in packages, shrinking features, and heterogeneous integration of chips. we are delighted to welcome the NovoLINC team to our semiconductor portfolio,” stated Tobias Egle, Associate at M Ventures.
NovoLINC’s technology addresses a critical challenge facing the rapidly evolving technology landscape. As computer chips become more powerful and compact, managing heat dissipation becomes increasingly complex. Excessive heat can lead to performance degradation, reliability issues, and increased energy consumption.
“There is a current goldrush in the tech community around AI applications, supported by ever more powerful chips and faster connections. Though, there is an increasing realization that this boom is capped by energy consumption and heat dissipation.NovoLINC addresses both head-on, and we are thrilled to back them as they start this journey,” Eric Rosenblum, Managing Partner at Foothill Ventures, shared.
NovoLINC’s proprietary nanostructured materials and manufacturing process enable the creation of exceptionally thin and heat-conductive thermal interface materials (TIMs). These innovative TIMs effectively reduce thermal resistance, allowing for more efficient heat transfer away from critical components. This translates to improved performance, reduced energy consumption, and extended lifespans for electronics.
“Cooling contributes to 40% of data center’s energy consumption. NovoLINC’s thermal interface solutions offer the industry’s lowest thermal resistance, and scalable solutions to keep up with the ever-increasing power and heat generated by the next-generation computing chips. We are excited to partner with NovoLINC to make chip cooling more efficient,” remarked tina Tosukhowong, Investment Director at TDK Ventures.
With this substantial funding, NovoLINC is well-positioned to accelerate its research and development efforts, expand its manufacturing capabilities, and bring its advanced thermal solutions to a wider market. The company’s technology is expected to play a vital role in enabling the lasting growth of high-performance computing,data centers,and other industries reliant on efficient heat management.
TDK Ventures: A Driving Force in Digital and Energy Conversion
In the dynamic landscape of technological advancement,TDK Ventures stands as a beacon of innovation.Established in 2019 as a wholly-owned subsidiary of the renowned TDK Corporation, this corporate venture capital firm is dedicated to propelling the digital and energy transformations across a range of crucial industries.
TDK ventures’ focus extends to sectors such as robotics and industrial automation, where it seeks to empower the next generation of groundbreaking solutions. Their vision also encompasses the transformative potential of next-generation transportation, where they invest in technologies that are reshaping the future of mobility.
Furthermore, TDK Ventures recognizes the immense possibilities of mixed reality and the burgeoning realm of the Internet of Things (IoT) and Industrial Internet of Things (IIoT). By strategically investing in these areas, TDK Ventures is actively shaping the future of connectivity, data-driven insights, and immersive experiences.
For those eager to delve deeper into the world of TDK ventures,their website,www.tdk-ventures.com, offers a extensive overview of their mission, investment strategies, and the innovative companies they support.
How does NovoLINC’s nanostructured composite material technology achieve industry-record-low thermal resistance?
Archyde Interview: NovoLINC’s CTO, Dr. Rui Cheng
Archyde News Editor: Welcome Dr. Rui Cheng,Chief Technology Officer of NovoLINC. Your company is making waves in teh thermal management field. Thanks for joining us today.
Dr. Rui Cheng: thank you for having me. I’m excited to share our innovative work at NovoLINC.
Archyde News Editor: Let’s dive right in.The heat generated by modern electronics, notably GPUs and CPUs, is becoming a critically importent issue.How is NovoLINC tackling this challenge?
Dr. Rui Cheng: Indeed, heat is a major bottleneck in the pursuit of faster and more powerful electronics.Customary thermal interface solutions are struggling to keep pace with the increasing heat loads. At NovoLINC, we’ve developed unique nanostructured composite materials that offer industry-record-low thermal resistance, enabling highly efficient heat transfer.
Archyde News Editor: Your technology seems to be a game-changer. can you tell us more about these nanostructured materials and how they achieve such low thermal resistance?
Dr. Rui Cheng: Sure. Our materials are engineered at the nanoscale, where we can tune their thermal conductivity and other properties with a high degree of precision. we use a proprietary manufacturing process involving self-assembly of nanoscale building blocks, which allows us to create highly ordered, low-thermal-resistance structures. This, combined with our understanding of phonon transport physics, enables us to outperform existing solutions.
Archyde News Editor: That’s impressive. How do these materials perform in real-world applications?
Dr. Rui Cheng: Our materials offer outstanding thermal performance, making them ideal for cooling high-power electronics like CPUs and GPUs. We’ve seen improved heat transfer efficiency, leading to reduced hotspot temperatures and enhanced system reliability. We’re currently working with semiconductor companies and hyperscalers to integration our technology into their products.
Archyde News Editor: NovoLINC’s breakthrough has certainly caught the attention of investors.You’ve secured significant seed funding. How will this capital help further your mission?
Dr.Rui Cheng: The funding will certainly accelerate our growth. We plan to use it to scale up our manufacturing capabilities, expand our team, and further develop our technology to meet the diverse needs of our customers. It’s also validation of our approach and the market demand for our solutions.
Archyde News Editor: Speaking of the market,AI and data-intensive applications are increasingly driving demand for more powerful processors. How does efficient thermal management like yours factor into this trend?
Dr.Rui Cheng: Efficient thermal management is indeed critical for these demanding applications.As AI and data processing needs continue to grow, so will the heat output of processors. Our technology is well-positioned to address this challenge, allowing for better performance, reliability, and energy efficiency in high-performance computing.
Archyde News Editor: Dr. Cheng,thank you for your insights. We’ll be eager to follow NovoLINC’s progress as you continue revolutionizing chip cooling.
Dr.Rui Cheng: thank you. we’re excited about the future and look forward to enabling more efficient and powerful electronics.
