2023-11-17 15:23:00
In addition to the new Filogic chips, MediaTek also presented solutions aimed at the Internet of Things (IoT) segment this Friday (17), during the Executive Summit 2023. The new features include the M60 modem and the T300 family chipsets.
They stand out for their support for RedCap technology – short for “reduced capacity” – which promises to bring the benefits of 5G to consumer, business and industrial devices with low bandwidth requirements.
“Our RedCap solutions are a significant part of our mission to democratize 5G, providing our customers with the ability to optimize components and deliver 5G-enabled devices across a range of applications and a range of price points. The migration to 5G RedCap will replace legacy 4G/LTE solutions, offering significantly better energy efficiency and more reliable user experiences compared to cutting-edge 5G eMMB modem solutions and legacy 4G LTE Cat 4 and Cat 6 devices.”
JC Hsu
MediaTek Corporate Senior Vice President
The MediaTek T300 series consists of the world’s first 6nm single-die solution in the RFSOC standard (Radio Frequency System-On-Chip). It comes equipped with a single-core Arm Cortex-A35 on a smaller PCB area. The T300 will support data rates of up to 227 Mbps download and up to 122 Mbps uplink.
Both it and the M60 modem will be compatible with the 3GPP R17 standard, to combine energy efficiency, improved coverage and ultra-low latency. The M60 also comes with UltraSave 4.0 technology, with a 70% reduction in energy consumption compared to similar 5G eMBB solutions, and up to 75% savings compared to 4G LTE solutions.
Availability
The MediaTek T300 series devices are expected to be shown in the first half of 2024, with commercial samples only in the second half of the same year.
What do you think of the new solutions with MediaTek’s RedCap technology? Participate with us!
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