2023-12-30 01:00:00
JEDEC Solid State Technology Association, an organization responsible for developing many consumer electronics standards, announced the launch of the CAMM2 memory module standard, which means improving the existing SODIMM form factor and providing soldered RAM. Signal integrity, density and compact form factor while maintaining SODIMM upgradeability.
There are currently two types of CAMMs released. DDR5 CAMM is suitable for high-performance notebook computers and potential desktop computers, while LPDDR5/LPDDR5X CAMM is suitable for thin notebook computers and certain servers. The electrical pins for each type of CAMM are incompatible with each other, and there are mechanical differences to prevent incorrect installation of different types of CAMMs.
As announced earlier this year, JESD318 CAMM2 supports stackable CAMM2: dual channel (DC) and single channel (SC). By splitting a dual-channel CAMM2 connector lengthwise into two single-channel CAMM2 connectors, each connector half takes CAMM2 to a different level. The first connector half supports one DDR5 memory channel at a height of 2.85mm, while the second connector supports a different DDR5 memory channel at a height of 7.5mm. Alternatively, the entire CAMM2 connector can be used with dual channel CAMM2. This scalability, from single- and dual-channel configurations to future multi-channel setups, heralds significant increases in memory capacity.
Mian Quddus, Chairman of the JEDEC Board of Directors, said: “The development of JEDEC CAMM2 demonstrates JEDEC’s commitment to providing innovative standards to the industry. CAMM2 is flexible in a variety of use cases and is designed with future scalability in mind.”
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