2024-01-30 18:00:00
A Intel and United Microelectronics Corporation (UMC), a leading global semiconductor foundry, announced a partnership to collaborate on the development of a 12-nanometer chip process platform.
According to the statement released by Intel, the partnership seeks to serve high-growth markets, such as notebooks, communication infrastructure and networking. The agreement also brings together manufacturing capacity at scale in the United States.
The 12nm node will use Intel’s US manufacturing capacity in designing FinFET transistors. The company highlighted that the production will benefit from UMC’s reputation and design assistance to effectively offer casting services to customers.
The new process node will be developed and manufactured in Fabs 12, 22 and 32 at Intel’s Ocotillo technology manufacturing facility in Arizona. Leveraging existing equipment at these fabs will significantly reduce upfront investment requirements.
Production of the 12nm process is expected to begin in 2027. It is worth remembering that Intel has been investing heavily in the USA. At the beginning of this year, the US government announced more subsidies for the company’s and TSMC’s chip factories.
“Taiwan has been a critical part of the Asian and global semiconductor and broader technology ecosystem for decades, and Intel is committed to collaborating with innovative companies in Taiwan, like UMC, to help better serve global customers,” he said Stuart Pann, senior vice president and general manager, Intel Foundry Services (IFS).
It is worth mentioning that UMC has been operating for more than 40 years as a supplier of casting services for critical applications, including automotive, industrial, monitors and communications. The company has more than 400 semiconductor customers.
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