2023-11-21 13:55:16
Two giants face each other: Qualcomm and MediaTek. These ARM chip designers have just presented two new chips almost simultaneously. We take stock.
Source: a nice montage by Frandroid
Qualcomm’s new Snapdragon 7 Gen 3
The Snapdragon 7 Gen 3, despite a name that suggests a simple evolution, is nevertheless markedly different from its predecessor, the SD 7+ Gen 2. Designed with TSMC’s 4nm process technology, it sports a 1+3+4 CPU layout. Its Kryo processor features a main core at 2.63 GHz, accompanied by 3 performance cores at 2.4 GHz and 4 efficiency cores at 1.8 GHz.
Qualcomm claims that the Snapdragon 7 Gen 3 outperforms its predecessor with a 15% improvement in CPU performance and an Adreno GPU that is 50% faster than that of the Snapdragon 7 Gen 1. In terms of power savings, the 7 Gen chip 3 would achieve an additional 20% savings.
The Hexagon NPU integrated into the SD 7 Gen 3 promises 60% better AI performance per watt than the SD 7 Gen 1, with support for OpenGL ES 3.2, OpenCL 2.0 FP, and Vulkan 1.3 APIs. Display support extends up to 4K resolution at 60 Hz or FHD+ at 168 Hz. The Snapdragon 7 Gen 3 is equipped with a Qualcomm Spectra ISP capable of handling main camera modules up to 200 megapixels and record 4K HDR video at 60 frames per second.
This new SoC is paired with the Snapdragon 5.3. The first devices equipped with this chip, including from Honor and Vivo, are expected later this month.
MediaTek counterattacks with the Dimensity 8300
MediaTek fights back with the Dimensity 8300, presented as “ultra-efficient” and significantly more efficient than its predecessor. It combines modern ARM Cortex-A715 and Cortex-A510 cores with a Mali-G615 GPU, all manufactured in 4nm.
The Dimensity 8300 consists of four ARM Cortex-A715 performance cores, one reaching 3.35 GHz and the other three 3.2 GHz, and four ARM Cortex-A510 efficiency cores at 2.2 GHz. MediaTek claims that this configuration offers 20% more performance and 30% lower power consumption compared to the Dimensity 8200. Its new ARM Mali-G615 MC6 GPU would achieve a 60% higher score in GFXBench Manhattan 3.0, with lower power consumption lower by 55%.
The integrated APU 780 is said to be capable of running generative AI software eight times faster, with double the floating point performance compared to the previous model. The Dimensity 8300 supports LPDDR5x 8533 memory and UFS 4.0 MCQ flash storage.
This chip also integrates a mmWave compatible 5G modem, Wi-Fi 6E, Bluetooth 5.4 and supports hardware-accelerated HEVC encoding. It is compatible with QHD+ 120 Hz or 1080p+ at 180 Hz displays, cameras up to 320 megapixels and 4K video recording at 60 frames per second. 4nm production, combined with modernized architecture, would reduce in-game power consumption by 25%; at low load, this consumption drops by at least 11%. Same thing as Qualcomm, the first smartphones equipped with this chip will not be long.
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