Glass Substrates: The Future of Semiconductor Packaging?
Table of Contents
- 1. Glass Substrates: The Future of Semiconductor Packaging?
- 2. The Rise of Glass in Semiconductors
- 3. Corning’s Foray into Semiconductor Glass
- 4. Enabling Microcircuits with Glass
- 5. Metal Deposition: Overcoming Technical hurdles
- 6. Conference Highlights and Future Outlook
- 7. How do the advantages of glass substrates in semiconductor packaging compare to traditional materials like silicon or plastic?
- 8. Glass substrates: The Future of Semiconductor Packaging? An Interview with Dr. Evelyn Reed
- 9. Interview: Dr. Evelyn Reed,Lead Materials Scientist at Corning
- 10. Advancements in Semiconductor Chemicals: A chat with Mr. Javier chen
- 11. Metal Deposition Techniques and future with Mr. Kai Lee
- 12. Looking Ahead: The future of Glass Substrates
Exploring the potential of glass in revolutionizing high-tech semiconductors, featuring insights from industry leaders.
The Rise of Glass in Semiconductors
The semiconductor industry is constantly pushing the boundaries of material science,seeking innovative solutions to enhance performance and efficiency. A promising contender in this arena is the semiconductor glass substrate, poised to potentially replace customary materials like silicone or plastic. Its appeal lies in its cost-effectiveness, superior physical properties, and suitability for advanced semiconductors, particularly those used in artificial intelligence (AI) applications. These AI systems frequently enough require large-area substrates, where glass’s inherent smoothness and dimensional stability offer a distinct advantage over existing materials.
Unlike conventional materials, the adoption of glass substrates necessitates a tailored approach. Optimization of glass composition and substrate processing is crucial for seamless integration into semiconductor manufacturing. This need has spurred significant research and development efforts within the glass industry,as companies strive to unlock the full potential of glass in this demanding field.
“It is a future substrate material to replace silicone or plastic,and has priced and physical competitiveness. In particular, it is suitable for high -tech semiconductors that require large -area substrates such as artificial intelligence (AI) because the surface is smooth and smaller than the existing substrate.”
For U.S.chipmakers, this shift towards glass substrates could mean a significant boost in manufacturing capabilities, particularly in producing advanced chips for AI and high-performance computing. The U.S. government’s focus on bolstering domestic semiconductor production through initiatives like the CHIPS Act makes the development and adoption of such technologies even more critical.
Corning’s Foray into Semiconductor Glass
Corning, a global leader in glass technology with over 170 years of experience, is making significant strides in the semiconductor glass substrate market. Corning recognized the prospect early and is actively accumulating expertise in this nascent field. With a long-standing presence in the Korean high-tech industry since 1972, Corning has a proven track record in delivering cutting-edge glass solutions.
Corning’s strategy for semiconductor glass substrates hinges on collaboration. Acknowledging the complexities involved in manufacturing reliable glass substrates, the company is actively partnering with key players across the substrate market. This collaborative approach extends to industry, academic institutions, and research organizations, fostering a holistic ecosystem for developing glass materials optimized for semiconductor applications.
This collaborative model mirrors the kind of partnerships that are becoming increasingly crucial in the U.S.semiconductor industry, as companies look to share the risks and costs associated with developing new technologies. For example, consortia like SEMATECH have historically played a crucial role in driving semiconductor innovation in the U.S.
Lee Hyun-sung,Director of korea corning,presented insights into the future of advanced packaging and the challenges and opportunities surrounding glass substrates at the ‘Electronic Newspaper Tech Day: All of the Semiconductor Glass Substrate’ conference on May 16,2024,held in Seoul at the POSCO Tower Yeoksam Event Hall.
Enabling Microcircuits with Glass
A key advantage of glass substrates is their ability to accommodate microcircuits. Similar to semiconductor wafers, substrates feature circuits that transmit electrical signals. Higher performance is achieved with thinner, more integrated circuits. This requires specialized chemicals to create the intricate circuits on glass substrates. Photosensitive liquids, or photoresists, produced by companies like WiChem, play a vital role in this process. These photoresists react to light, enabling the creation of microcircuits on the glass substrate by altering its properties upon exposure.
“Like a semiconductor wafer, there is a circuit that delivers electrical signals on the substrate, the higher the thinner and more integrated, the higher the performance substrate. This requires several chemicals to form a glass substrate circuit.”
WiChem, with over two decades of experience in developing and supplying photoresists for semiconductor manufacturing, has successfully developed and commercialized glass-specific solutions. The company also provides glass plate strippers and developers, positioning itself as a key chemical supplier in the glass substrate industry.
Kim Yong-il, Managing Director of WiChem, discussed the current status of core materials and market strategies for semiconductor glass boards at the conference, focusing on the critical role of materials in the glass substrate manufacturing process.
Metal Deposition: Overcoming Technical hurdles
Metal deposition is crucial for signal transmission in glass substrates. It involves forming a thin metal film on the substrate, requiring strong adhesion and high purity and density to achieve high performance. However, due to the unique characteristics of glass, this process presents significant technical challenges compared to traditional materials.
Jusung Engineering is tackling these challenges with innovative technologies, particularly in the realm of atomic layer deposition (ALD). ALD involves stacking ultra-thin layers of material on the surface through metal evaporation. Jusung Engineering’s expertise extends beyond semiconductors to displays, showcasing their versatility in handling glass materials.
In the U.S., companies are also exploring advanced deposition techniques like sputtering and chemical vapor deposition (CVD) to improve the quality and reliability of metal films on glass substrates. These efforts are driven by the need to create interconnects that can withstand the high operating frequencies and temperatures of modern semiconductors.
Jusung Engineering has developed a new technology that minimizes damage to glass substrates during ALD. Traditional ALD processes frequently enough require high temperatures (over 1000 degrees Celsius), which can damage or melt the circuits on the glass. jusung Engineering’s innovation reduces the temperature to 400 degrees Celsius, enabling stable glass substrate manufacturing.
“Jusung Engineering has recently secured new technologies that can minimize the damage to glass substrates. ALD is usually done at a high temperature over 1000 degrees,which may be broken or the circuit melt. the new technology of Jusung Engineering is the first in the industry to reduce the temperature to 400 degrees, allowing the glass substrate to be stably manufactured.”
yoo Jin-hyuk, Vice President of Jusung Engineering, highlighted this glass substrate innovation, emphasizing the company’s commitment to leading the market with its core deposition technology.
Conference Highlights and Future Outlook
The ‘Electronic Newspaper Tech Day: All of the Semiconductor glass Substrate’ conference provided a platform for industry leaders to share their insights and advancements in glass substrate technology.The discussions underscored the potential of glass substrates to revolutionize semiconductor packaging and enable the next generation of high-performance devices.
For the U.S. semiconductor industry, the development and adoption of glass substrates could offer a competitive edge in the global market. by investing in research and development, fostering collaboration, and addressing the technical challenges associated with glass manufacturing, the U.S. can solidify its position as a leader in semiconductor innovation.
| Company | Focus Area | Key Technology/Product |
|---|---|---|
| Corning | Glass Substrate Development | Optimized glass materials for semiconductors |
| WiChem | Semiconductor Chemicals | Photosensitive liquids (photoresists) for glass substrates |
| Jusung Engineering | Deposition Technology | atomic Layer Deposition (ALD) for metal films on glass |
How do the advantages of glass substrates in semiconductor packaging compare to traditional materials like silicon or plastic?
Glass substrates: The Future of Semiconductor Packaging? An Interview with Dr. Evelyn Reed
Archyde News Editor, May 17, 2024
Interview: Dr. Evelyn Reed,Lead Materials Scientist at Corning
Archyde News editor: Dr. Reed, thank you for joining us. Glass substrates are generating a lot of buzz in the semiconductor world. From Corning’s perspective, what are the primary advantages of glass compared to traditional materials like silicon or plastic?
Dr.Evelyn Reed: Thank you for having me.The benefits of glass substrates are multifaceted. Firstly, glass offers superior planarity and dimensional stability, crucial for the increasingly complex designs of advanced semiconductors, especially those used in AI. Secondly, glass is cost-competitive while also offering excellent electrical and thermal properties, vital for improving the performance of chips. We also find it very suitable for large-area substrates, a growing demand in the industry.
Archyde News Editor: Corning has been a frontrunner in glass technology for a long time. What specific innovations are you focusing on to optimize glass for semiconductor applications?
Dr.Reed: Our main focus is on refining substrate composition and manufacturing processes. We’re working to develop glass formulations that meet the rigorous demands of modern semiconductors. This involves fine-tuning the glass’s thermal expansion, dielectric properties, and surface finish to ensure seamless integration into chip manufacturing. We are also focused on developing collaborative partnerships to drive the adoption of this technology.
archyde News Editor: The article mentions the importance of collaboration. Can you elaborate on the value of partnering with stakeholders across the semiconductor ecosystem?
Dr. Reed: Collaboration is key. Developing reliable semiconductor glass substrates requires a deep understanding of various aspects: glass composition, processing, manufacturing equipment, and downstream integration. Working with chipmakers,research institutions,and equipment suppliers enables us to create tailored solutions and accelerate the progress cycle. This cooperative approach fosters innovation and mitigates risks associated with such significant advancements.
Advancements in Semiconductor Chemicals: A chat with Mr. Javier chen
Archyde News Editor: Mr. Chen, thanks for speaking with us. Wichem plays a critical role in this technological evolution with their photoresists, and what advantages does Wichem’s photoresists for these glass substrates offer compared to standard silicon wafer photoresists?
Mr. Javier Chen: Thank you. Our photoresists are specially formulated to address the unique surface characteristics of glass. Specifically, surface smoothness and chemical compatibility are important in the circuit formation, and our glass-oriented resists are designed to interact with glass in ways that optimize adhesion and patterning performance. This results in more precise microcircuits and improved device yield.
Archyde News editor: Let’s talk about challenges; what have been some of the major hurdles you faced while working on glass substrate material?
Mr. Javier Chen: A key one is achieving the right balance of sensitivity and resolution within our photoresists so that you can meet the high-density circuit requirements. Moreover, as these new glass processes are complex, we have had to develop new strippers and developers. Also, managing the thermal expansion differences between the glass and photoresist throughout the manufacturing is critical.
Metal Deposition Techniques and future with Mr. Kai Lee
Archyde News Editor: Mr.Lee,Jusung Engineering is developing advanced deposition technology. What unique approach is Jusung engineering bringing to ensure precise and dependable metal film development in this crucial stage?
Mr. Kay Lee: Our work is centered on atomic layer deposition (ALD). The challenge lies with achieving an ultra-thin, highly uniform metal film layer, while minimizing damage to the glass. one of our innovations has been reducing the ALD temperature down to 400 degrees Celsius. This ensures less damage and makes stable glass substrate manufacturing possible.
Archyde News Editor: With the semiconductor industry moving toward more advanced chips, how do you foresee the future integration of glass substrates?
Mr. Kay lee: Our innovation allows for glass to be manufactured in a stable way, and we plan to continue developing this, looking at the ALD methods to allow for more integrated solutions. Reducing the temperature is just the beginning here at Jusung Engineering, and we are excited to continue developing the technology.
Looking Ahead: The future of Glass Substrates
Archyde News Editor: Dr. Reed, considering the rapid pace of technological advancement, what’s the most exciting aspect of the future of glass substrates in semiconductors?
Dr. evelyn Reed: The most exciting aspect is the potential to truly transform the architecture of computing and the potential to deliver new technological capabilities. We’re on the cusp of a more interconnected, efficient future, and glass substrates are a essential enabler. The ability to manufacture components with greater precision will allow devices to become faster and far more capable. This transformation will impact every industry, from healthcare to transportation. With the support of goverment focus on domestic semiconductor production, this is an exciting time for the advancement of glass substrates in the U.S.
Archyde News Editor: Thank you both for your time and insights. Your expertise has provided invaluable perspective on glass substrates.
