2024-03-28 21:08:13
Recent analyzes indicate that the architecture of the chip M3 Max would be preparing the ground for a “M3 Ultra” even more powerful. Unlike its predecessors, the latest (so far) high-end processor does not feature UltraFusion interconnect technology.
This architectural analysis was published by YouTuber Vadim Yuryev. He suggests that by giving up this interconnection, Apple will be able to give more powerful variants a previously unattainable performance advantage.
Traditionally, Apple used UltraFusion to combine two Max chips into a single Ultra chip. The absence of this technology in the M3 Max sparked speculation regarding future plans for the current line of chips, launched last October.
Yuryev believes that because the M3 Max is a completely redesigned and independent chip, this might lead to the development of an extremely powerful “Ultra” variant in the near future.
This change in the structure of the chips might result in the “M3 Ultra” having a greater number of cores dedicated to performance and graphics (GPU), instead of relying on efficiency cores, which were common in previous versions.
Furthermore, a possible development of an “Extreme” chip (this one, made up of two connected Ultras) arouses interest, mainly for hard users and professionals looking for performance. However, it is possible that Apple uses this “trick up its sleeve” only in the “M4” chip line.
via MacRumors
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