Samsung Electronics Chairman Lee Jae-yong visited the Cheonan and Onyang campuses of Samsung Electronics on the 17th to inspect next-generation package competitiveness, R&D capabilities, and mid- to long-term business strategies.
The management meeting held at Samsung Electronics’ Cheonan Campus on this day was attended by Gyeonggi-hyeon, head of the DS division, Jeongbae Lee, head of the memory division, Siyoung Choi, head of the foundry division, and Yongin Park, head of the system LSI division.
Chairman Lee said, “Although it is a difficult situation, we must not waver in the slightest in nurturing talent and investing in future technology.” I took a look at the production line.
On this day, Chairman Lee Jae-yong held a meeting at the Onyang Campus and encouraged the staff of the package technology development department. Employees in attendance explained the pride they felt as developers, new technologies, development goals, and difficulties, and Chairman Lee Jae-yong expressed his gratitude for the dedication and efforts of the executives and employees.
On the other hand, semiconductor packaging is a process of manufacturing semiconductors in a form suitable for electronic devices, and it is an essential step to create a passage through which electrical signals flow and process the exterior to commercialize it.
In particular, semiconductor package technology with high-performance and low-power characteristics is required in various fields such as artificial intelligence (AI), 5G, and electric vehicles. It is rising.
