2024-08-27 06:00:08
The ever-increasing use of electronic devices is leading to energy waste in the form of waste heat. A new material could transform this heat into electricity, offering promising prospects for more sustainable technologies.
A team of international researchers has developed a thermoelectric alloy composed of silicon, germanium and tin, all from group IV of the tableau periodic. This innovative alloy could be integrated into the manufacturing processes of current electronic chips, thus making it possible to convert the heat produced by processors in electrical energy. This work was published in ACS Applied Energy Materials.
Currently, in Europe, about 1.2 exajoules of low-temperature heat are lost every year by IT infrastructures, such as data centers data and smart devices. This heat, equivalent to the consumption ofenergy annual production of countries such as Austria or Romania, represents an underexploited energy source due to the technological challenges associated with its recovery.
The combination of germanium and tin has proven to be a particularly interesting combination for thermoelectric applications. According to Dr. Dan Buca from the Jülich Research Center, adding tin to germanium reduces the thermal conductivity while retaining electrical properties, making it a candidate ideal for the conversion of heat into electricity.
Integrating this alloy into silicon chips could enable direct recovery of waste heat generated during processor operation, reducing the need for external cooling and additional power supply. This approach paves the way for more durable and energy-efficient computing devices.
Professor Giovanni Capellini of the IHP points out that this breakthrough could have a major impact on so-called “green” IT infrastructures. Research continues with the aim of extending the composition of this alloy to other combinations, such as SiGeSn, and ultimately, of developing a fully functional thermoelectric device.
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