Team leader Park Geun-soo introducing ASUS BTF design products. / Source = IT Donga
[IT Dong-a, reporter Kang Hyung-seok] ASUS has introduced the ‘BTF design’ as a strategy to revitalize the assembled PC market. Named after the movie “Back to the Future,” this design features the relocation of power connectors for PC components to the back of the motherboard instead of the front. Traditionally, in assembled PCs, the main and auxiliary power connectors are situated at the top of the motherboard, which means that cables are inevitably visible no matter how much internal organization is attempted. In contrast, the BTF design only exposes the key components and the coolant hoses of the water cooling system.
Park Geun-soo, head of the PR and marketing team at ASUS Korea’s component division, stated, “With the main power cable routed to the back, the interior of the assembled PC appears tidier. Only air-cooled cooling devices, which cannot route cables to the back, will have exposed cables. Although these cables may appear messy, they can impact airflow inside the case, and I anticipate that the BTF design will become the future mainstream in the market.”
The design structure that conceals the power connectors was first unveiled in the latter half of last year when ASUS introduced the ‘TUF Gaming B760M-BTF series’ based on the Intel B760M chipset. However, the power connector being placed at the back of the motherboard raised compatibility concerns with existing PC cases, as the side mounting plates for securing the motherboard were not adjusted to fit the new design. Since then, various PC cases compatible with the BTF design have been launched, starting with Micronics, partially resolving the compatibility issues.
In addition to ASUS, other motherboard manufacturers, such as Gigabyte, MSI, and Asrock, are also exploring the BTF design. They have either released or are in the process of developing products known as Stealth and Project Zero, respectively. ASUS predicts that the product adoption based on the BTF design might accelerate after the second half of 2025, as the process of updating existing products with new standards requires time for design changes and testing.
Advantages of BTF: Neat Organization and Heat Management
Upon examining the displayed BTF system, it is clear that the interior is well-organized. Beyond motherboards, ASUS has also applied the BTF design to graphics cards. The showcased product is the GeForce RTX 4090, which demands 600W of power. Typically, there is an auxiliary power connector at the top, but this particular graphics card features a separate connector at the bottom to receive 600W of power.
Inside a PC with Asus BTF products. Most of the cables are hidden. / Source = IT Donga
The advantages of the BTF design extend beyond its neat appearance. It notably enhances heat management and offers an intuitive layout for system operation and power cable connections. The most significant benefit is heat management. In conventional assembled PCs, primary components and cables connect at the top of the motherboard, causing the heat emitted by cooling devices and graphics cards to circulate within the case, raising the internal temperature. Additionally, power supply cables contribute to this temperature rise due to their load. The heat from the motherboard itself is also considerable.
By relocating the power connectors to the back, heat generated by components is allowed to flow forward, while the heat from the power cables moves to the rear. This change eliminates many obstacles to airflow within the case. Ultimately, the focus can remain on the cooling device’s performance and the optimal placement of cooling fans for internal airflow. Conversely, the rear area, where the cables are concentrated, might become a surprisingly vulnerable spot, as it is challenging to install cooling fans at the back of most PC cases.
In addition to the clean internal configuration, the BTF design also has the advantage of heat dissipation. / Source = IT Donga
Securing internal space remains a concern for the PC case industry. To accommodate products that align with the BTF design, existing spaces must be maintained while simultaneously creating room for proper rear cable management. This situation inevitably leads to increased production costs. While there may be no issues if the BTF design dominates the market in the future, currently, there are challenges in catering to consumers who prefer pre-built PCs.
As it is not an official standard, potential issues must be addressed.
Asus, which pioneered the BTF design, has a diverse lineup of products available. Currently, there are three motherboards based on the Intel Z790 and B760M chipsets, along with two graphics cards, the GeForce RTX 4070 Ti Super and the RTX 4090, in the market. However, other manufacturers have yet to release any products. MSI, which is involved in Project Zero, has launched one motherboard in the domestic market.
ASUS’s BTF design products. In addition to the three motherboards and two graphic cards that have been released, they will continue to introduce new products. / Source = IT Donga
Another issue that needs to be addressed is that many components lack official standards like ATX or m-ATX; instead, they are designed by individual manufacturers. This variability means that the connectors positioned on the back may differ among manufacturers. While this may not impact motherboard manufacturers, it presents a significant challenge for PC case manufacturers in terms of ensuring compatibility. Each manufacturer must negotiate and establish consistency regarding the connectors and configurations situated on the back of the motherboard.
Team Leader Park Geun-soo concluded, “As it is still in its early stages, the number of products is limited, and prices are high. However, ASUS is striving for its wider adoption. I believe any concerns will be resolved quickly. Other manufacturers are also developing products aligned with this concept, leading to the establishment of common ground.”
Written by / IT Donga Kang Hyung-seok (redbk@itdonga.com)
ASUS BTF Design: Revolutionizing the Assembled PC Market
Team leader Park Geun-soo introducing ASUS BTF design products. / Source = IT Donga
[IT동아 강형석 기자] ASUS has introduced the ‘BTF design’ aiming to innovate the assembled PC market. Inspired by Back to the Future, this design moves the power terminals that connect to PC components to the rear of the motherboard, leveling up aesthetics and performance. Traditionally, power connectors are positioned at the top of the motherboard, resulting in visible cable clutter regardless of internal organization. The BTF design emphasizes showcasing the main components while discreetly managing the coolant passages of water cooling systems.
Understanding BTF Design
As explained by Park Geun-soo, head of the PR and marketing team at ASUS Korea’s component division, “Rerouting the main power cable to the back makes the interior of assembled PCs much cleaner.” While air-cooled systems will still reveal exposed cables, this design significantly mitigates the visual and airflow issues commonly associated with traditional setups. “I predict the BTF design will become mainstream in the future,” he added.
The innovative structure was first unveiled in late 2023 with the launch of the ‘TUF Gaming B760M-BTF series’ based on the Intel B760M chipset. However, the rear positioning of the power connector initially raised compatibility concerns with existing PC cases, as traditional designs lacked the necessary perforations. Fortunately, compatibility issues were gradually addressed with newer PC cases such as those introduced by Micronics.
Industry-Wide Interest
ASUS isn’t alone in this venture; motherboard manufacturers like Gigabyte, MSI, and Asrock are exploring the BTF concept. They are developing their versions under names like Stealth and Project Zero. ASUS anticipates a broader adoption of BTF design products after the second half of 2025, which will depend on adjusting existing products and passing industry the necessary testing.
Advantages of the BTF Design
The advantages of the BTF system extend beyond just aesthetics. Key benefits include:
- Neat Cable Management: Internal arrangements are much cleaner, enhancing the product’s overall visual appeal.
- Improved Heat Management: With power connectors relocated, circulation of heat improves, resulting in lower overall temperatures.
- Enhanced Airflow: The BTF design minimizes obstructions, optimizing airflow from cooling systems.
- Streamlined System Operation: Intuitive cable connections make for easier system setups and upgrades.
In ASUS’s demonstration, the BTF design was applied not only to motherboards but also to graphics cards, such as the GeForce RTX 4090, which typically demands 600W. Unlike standard configurations, this graphics card features a dedicated terminal at the bottom for power input.
Inside a PC with Asus BTF products. Most of the cables are hidden. / Source = IT Donga
Benefits of Heat Management
One of the biggest issues in traditional PC builds is heat management. Typically, components and their cables are clustered at the top of the motherboard where heat accumulates. The BTF design alleviates this issue; routing the power connector to the back redistributes heat effectively. Major components push heat towards the front while transferring cable heat to the back, separating hot and cool air flows.
Park Geun-soo shared insights on this aspect: “We’ve verified sufficient heat dissipation in larger PC cases. Small and medium-sized cases have shown promising test results without concerns, although we maintain thorough monitoring.”
Challenges Ahead for BTF Design
While ASUS’s BTF design shows immense potential, hurdles remain. Since it is not yet an official standard like ATX or m-ATX, complications may arise from differing manufacturer configurations. The variation in terminals and layouts among manufacturers can create challenges for PC case manufacturers to ensure compatibility and sufficient space for the BTF design layout.
“We’re in early introduction stages,” noted Park, highlighting that while the number of available products is low and costs are high, ASUS is committed to normalizing these developments. They hope to find common ground with other manufacturers working on similar concepts.
Product Availability
ASUS has made significant strides in developing a diverse product line featuring the BTF design. Currently, they offer three motherboards based on Intel’s Z790 and B760M chipsets, along with two graphics cards: the GeForce RTX 4070 Ti Super and RTX 4090. While MSI released a motherboard featuring Project Zero, other major brands have yet to launch similar products.
ASUS’s BTF design products. / Source = IT Donga
Steps Towards Standardization
To ensure the success of BTF design, harmonization among manufacturers will be essential. Each company must collectively manage configurations and standardize terminal layouts to prevent potential consumer confusion and compatibility issues.
Conclusion
Although still in its infancy, the BTF design represents a leap forward in PC assembly aesthetics and functionality. Its emphasis on clean cable management and heat dissipation provides an appealing proposition for both builders and gamers. As the industry gradually aligns towards a cohesive standard, the BTF design may soon redefine our expectations of assembled PCs.
