2024-03-01 22:00:00
Qualcomm Technologies, Inc. has presented the mobile connectivity system FastConnect 7900, the first to offer performance optimized by AI and integrate Wi-Fi 7, Bluetooth and Ultra Wideband technologies on a single chip.
Using AI, FastConnect 7900 adapts to specific use cases and environments, delivering significant optimizations across power consumption, network latency and throughput. This system integrates ultra-wideband technology, Wi-Fi Ranging and Bluetooth Channel Sounding to create a powerful set of proximity technologies that enable detection, access and control of devices with a high level of security.
On the other hand, FastConnect 7900 takes advantage of a new class of RF front-end modules and the Next-generation implementation of High Band Simultaneous technology, a key innovation of the Wi-Fi 7 era at the heart of multi-device experiences and fundamental to Qualcomm Expanded Personal Area Network (XPAN) and Snapdragon Seamless experiences.
Javier del Prado, vice president and general director of mobile connectivity at Qualcomm Technologies, stated the following in this regard:
“FastConnect 7900 is a technological feat that leverages artificial intelligence to raise the bar and deliver the best Wi-Fi 7 and Bluetooth features, while integrating Ultra Wideband on a single 6nm chip,”
Then he adds that:
“The system brings next-level capabilities through AI, proximity and multi-device experiences on the devices we love most.”
For more information regarding the mobile connectivity system Qualcomm FastConnect 7900, visit the website from the company.
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