2023-12-31 12:56:00
Taiwanese semiconductor company TSMC is set to open its first semiconductor factory in Japan on February 24, 2024 — opening what is expected to be one of Japan’s most advanced facilities in this sector. It will be located near Kumamoto on the island of Kyushu using TSMC’s advanced N28 technology.
The factory will have the capacity to produce chips using several variants of N28 technology, including the 22ULP manufacturing process designed for ultra-low power applications. Although these technologies are considered outdated for smartphones, PCs and high-performance processors, they are suitable for components used in the automotive and home appliance sectors, meeting the demand of the local Japanese market.
The formal opening is scheduled for February, with chip production beginning in the second half of 2024. Rumors suggest that TSMC plans to build a second factory in Japan, capable of processing wafers using technologies derived from the N16 process.
Common Initial investment estimated at US$7 billion and a monthly capacity of 45,000 wafer starts, the factory will employ approximately 1,700 people when fully operational. It currently has around 1,400 employees, and is expected to add 250 new employees by June.
This strategic move by TSMC, a global leader in contract chip manufacturing, reflects its response to the growing demand for semiconductors and its adaptation to the current geopolitical scenario.
The company is also collaborating with Sony to build the factory and is establishing a research and development center in Japan, as well as participating in collaborative projects with the University of Tokyo.
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