2023-09-27 00:54:56
Xinhuanet, Beijing, September 26 (Reporter Guo Yujing) On the 25th, the 2023 Beijing Microelectronics International Symposium and IC WORLD Conference opened at the Beijing Economic Development Zone Yichuang International Convention and Exhibition Center. Jin Wei, deputy mayor of Beijing, said at the opening ceremony that in recent years, Beijing has taken the initiative and boldly innovated, exploring an industrial development model with efficient coordination of innovation chain, industrial chain and supply chain, and cultivating an industry with a scale of hundreds of billions. The leading industry has become an important highland for the development of my country’s integrated circuits and an important support for innovative development.
Facing the future, Beijing adheres to the concepts of open innovation and win-win cooperation, fully promotes collaborative innovation and industrial cooperation, promotes independent innovation amid deep global integration, and accelerates the construction of an internationally influential integrated circuit industry cluster and innovation highland.
At the opening ceremony, the Tongming Lake Integrated Circuit Design Community construction plan was released and the signing ceremony of the first batch of projects entering the park was held. The Beijing Economic and Technological Development Zone Management Committee signed contracts with the first batch of 6 platforms and 10 projects to enter the park.
The opening ceremony of the conference. (Photo courtesy of the interviewed unit)
The 2023 Beijing Microelectronics International Symposium and IC WORLD Conference is hosted by the Beijing Municipal Bureau of Economy and Information Technology and the Beijing Economic and Technological Development Zone Management Committee, and is sponsored by the Beijing Semiconductor Industry Association, Zhongguancun Core Chain Integrated Circuit Manufacturing Industry Alliance, SEMI China, and Beijing Integrated Circuit Hosted by the Society. The theme of the conference is “Condensing the core and gathering strength to sail forward” and consists of two parts: an academic forum and an expo.
The academic forum includes 1 summit forum, 11 special sub-forums and 1 symposium. Hundreds of experts, scholars and business leaders from the world’s top universities, research institutions and integrated circuit industry chain companies will focus on the development trends of the integrated circuit industry in 2023. Conduct high-level academic exchanges with cutting-edge technologies. The 11 sub-forums continue to focus on pain points such as the continuous development of integrated circuit equipment, materials, and components, focusing on cutting-edge integrated circuit technology, intelligent computing, automotive semiconductors, advanced packaging and other hot topics, and the first Beijing-Tianjin-Hebei integrated circuit industry collaborative development symposium was set up , to help the Beijing-Tianjin-Hebei industrial chain innovation chain in-depth integration.
The expo consists of three major exhibition areas: the industrial chain achievement display area, the enterprise area, and the industry-university-research area. More than 130 units including industrial chain enterprises, universities, and industry organizations participated in the exhibition, fully displaying the current development results of the integrated circuit industry chain.
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