2023-05-31 17:05:03
A new and extensive report published today by The Information sheds light on the complex manufacturing process of the supposed virtual/augmented reality headset and Apple, expected for WWDC23. According to the information, the device may well have one of the most challenging productions of the entire Apple product line to date — which would explain its rumored price of US$3 mil.
According to Wayne Ma, author of the report, the Apple headset has an “unconventional curved design”, in addition to being very thin and light. These characteristics, according to him, led Apple to develop a curved piece of glass surrounded by a “smooth aluminum structure”, which would be slightly thicker than the iPhone.
This piece of glass even seems to have aroused some concern on the part of Apple engineers, especially with regard to its durability and safety. The biggest challenge, according to the report, has been balancing the piece’s resistance with its weight and thickness — which can make it the most fragile item in the entire set.
In addition to this piece, Apple also had to develop a curved motherboard that would fit inside the headset — something completely unheard of for the company. The construction of the device would also have a rather narrow profile, which can pose certain problems for people who wear glasses, for example.
Furthermore, the user will be able to switch between virtual and augmented reality modes using a small crown located on top of the left eye of the headset, and a conventional power button can be found on the left. A connector similar to the magnetic charger on an Apple Watch runs from the left side of the headset to the device’s external battery.
Still according to the report, the headset would be being produced in the same factory as the never-released AirPower, commanded by Luxshare. Its mass production, however, should only start from July, which indicates a launch only at the end of this year, as Apple usually takes “several months to increase the production of its products”.
Ma also corroborated the information that the headset will use Micro-OLED displays, released yesterday by Ross Young. According to the author, they would be so expensive that Apple would have chosen to repair the defective units instead of simply discarding them. Sony, in turn, would be facing problems producing more than 250,000 panels this year due to its high pixel density (4,000ppp, according to Young).
All components, finally, would be so densely packed inside the headset that factory workers would be having problems assembling the device – remembering that most Apple products are assembled by hand. Due to the limited space, employees would be having to fit the pieces from unconventional angles.
At the beginning of the development of the headset, Apple produced 200 units per day, but only 20 managed to meet the quality standards stipulated by the company. To get around this, the company would have made changes to the product’s design until the last month of April.
So, looking forward to next Monday? Remembering that WWDC23 will take place between June 5th and 9th!
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