Xiaomi ‘Redmi 12C’ package box leaked ahead of global launch

The package box image of the latest entry-level smartphone ‘Redmi 12C’ global model of Chinese smartphone maker Xiaomi sub-brand Redmi was leaked online.

‘Redmi 12C’ was released in China last month. It features a 5MP selfie camera and a 6.71-inch HD+ display with a notch design and is powered by a MediaTek Helio G85 processor. On the back, it comes with dual cameras including a 50MP main camera along with a fingerprint scanner.

Inside, it comes with up to 6GB of LPDDR4X RAM and 64/128GB of storage expandable up to 512GB via a microSD card slot. In addition, it comes with a 5000mAh battery, a microUSB port and a 3.5mm headphone jack.

The ‘Redmi 12C’ global model is expected to be unveiled before MWC 2023, which will be held in Barcelona from the 27th of this month to the 2nd of March. Rumors are also circulating that it will be released in India under the name of ‘Poco C55’.

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