Lenovo recently shared a teaser that confirmed the efficiency of the new cooling system in the upcoming Legion Y70 gaming phone.
Lenovo is soon preparing to launch a new version of phones dedicated to gaming, and the teasers revealed some of the specifications of the upcoming Legion Y70 phone before the upcoming event for the official announcement on August 18.
Lenovo offers the Legion Y70 gaming phone with a cooling system that includes a vapor chamber that occupies an area of 5047 square mm with a thickness of 0.55 mm, from a thickness of 0.8 mm in the design of the phone in general without the protruding part of the camera.
The Legion Y70 will also come with rear camera settings that include a 50-megapixel main sensor, with optical stabilization.
It also includes a 10-layer cooling system that includes a more efficient cooling mechanism in the phone, as Lenovo confirms in the teaser that the phone’s cooling system simulates the refrigerator.
It is noteworthy that the design of the Legion Y70 confirms that the phone comes with a strong design for games, as it is also compatible with the traditional user, and it is scheduled to include operating buttons for side games, along with a Snapdragon 8+ Gen 1 processor chip, and 16 GB random memory, and also supports The phone has a 68W fast charging technology.