尹-Biden signs ‘3-nano wafer’, symbol of semiconductor alliance

[오늘 한미정상회담]

Technology alliance message with cutting-edge semiconductors
Biden: ‘Thanks U.S. for Foundry Building’

President Seok-Yeol Yoon and President Joe Biden of the United States sign autographs for a state-of-the-art 3-nano process semiconductor wafer at Samsung Electronics’ semiconductor plant in Pyeongtaek, Gyeonggi-do, on the 20th. Pyeongtaek = Reporter Yang Hoe-seong [email protected]

On the 20th, the leaders of the two countries visited Samsung Electronics’ Pyeongtaek semiconductor factory, introducing cutting-edge semiconductor technology and cases of technological cooperation between Korea and the United States.

President Seok-Yeol Yoon and President Joe Biden of the United States started a tour of the P3 production line following signing a state-of-the-art 3 nanometer (nm, 1 nm is 1 billionth of a meter) process semiconductor wafer instead of a guest book.

3-nano semiconductors are produced by making circuits on a wafer (semiconductor substrate) with a width of 3 nanometers, which is only 3/100,000 the thickness of a human hair. The ultra-fine semiconductor process is more advanced as the circuit line width is smaller. Compared to the 5nm process, 3nm can reduce chip area and power consumption by 35% and 50%, respectively, and can make semiconductors with 30% faster processing speed.

After developing 3-nano semiconductors in 2019, Samsung Electronics is aiming to mass-produce the world’s first in the first half of this year (January to June). TSMC in Taiwan is scheduled for the second half of this year (July to December). President Biden said, “Samsung is releasing cutting-edge 3-nm semiconductor products.

U.S. semiconductor equipment makers such as Lam Research and KLA took part in the explanation and showed the site of Korea-U.S. technological cooperation. Behind the stage where the leaders spoke, Samsung employees of American nationality were seated and attracted attention.

Reporter Kwak Do-young [email protected]

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