TSMC (2330-TW)(TSM-US) today (14th) held a law meeting, at which the first-quarter financial report was announced. The briefing showed that high-performance computing (HPC) accounted for 41% of revenue in the first quarter, surpassing 40% of smartphones for the first time. The mobile phone industry is gradually entering a plateau period, which also symbolizes the coming of the era of high growth of HPC.
President Wei Zhejia is optimistic that HPC demand will continue to be strong this year, and the annual growth rate will exceed the company’s average growth rate, which is the main revenue growth driver. In addition, the annual growth rate of advanced packaging performance will also be better than the company’s average.
The industry pointed out that with the expansion of HPC applications in recent years, coupled with the trend of high bandwidth, high performance, and low power consumption, and the demand for advanced packaging, TSMC CoWoS has benefited from the growth of HPC applications. , which is close to the annual revenue growth rate of nearly 30% in the same period.
The industry is optimistic, because TSMC’s past advanced packaging performance mainly comes from InFO, accounting for regarding 80% of its revenue, but with the future development of HPC and AI applications, the growth of CoWoS performance will accelerate, accounting for 30% of the overall advanced packaging revenue. , and InFO dropped to 70%, effectively diversifying product risks.
In response to the future growth of HPC and other markets, TSMC has recently released 3DIC for the first time. It is expected that the world’s first mass production plan of SoIC will be carried out in the advanced packaging plant of Zhunan Factory in the second half of this year.
