News on March 10th, today, Redmi officially announced that it will hold the K50 flagship series conference at 19:00 pm on March 17th. At that time, the K50 series equipped with Dimensity 9000 and Dimensity 8100 will officially debut.
As the press conference approaches, the official has also accelerated the warm-up rhythm of the new phone. This followingnoon, @Redmi Redmi official Weibo announced the actual measurement of the “Genshin Impact” of the K50 series. The data shows that at 59fps very close to the full frame, the body temperature of the K50 series is 46°C following one hour of testing. It can be said that this result is quite impressive.
The official said, “Dimensity’s high performance, K50 ice cooling, and several adjustments tailored by the project R&D team have created a new record for you.”
As we all know, “Yuanshen” has long been a test tool for mobile phone performance, and “running a score if you refuse to accept” has also become “running “Yuanshen” if you refuse to accept it. It is enough to see that this game has high performance requirements and also tests The adjustment ability of the mobile phone manufacturer to the chip and the heat dissipation performance of the mobile phone. At present, Redmi has not announced the heat dissipation configuration of the K50 series, and it has to wait for further official revelations.
It is reported that MediaTek Dimensity 9000 adopts TSMC’s 4nm process and consists of 1 Cortex-X2 super core, 3 Cortex-A710 large cores and 4 Cortex-A510 small cores. The GPU is ARM Mali-G710. 1 million points, comparable to Qualcomm Snapdragon 8.
According to previous news, the Redmi K50 series has three models: Redmi K50, Redmi K50 Pro, and Redmi K50 Pro+, which are equipped with Snapdragon 870, Dimensity 8100, and Dimensity 9000 chips respectively.
Further reading:
