This followingnoon (May 23) at 14:00, AMD will hold a theme event for the opening of the Taipei Computer Show. From the preheating point of view, the protagonists of this event will be the 5nm Zen 4 Ryzen 7000 processor, X670/B650 chipset motherboard, etc. .
Before the press conference, the relevant content seems to have leaked.
It is reported that the Zen 4 processor adopts a small chip design, in which the computing core (CCD) is 5nm and the I/O Die is 6nm, which is a huge improvement compared to the previous generation’s 7nm+12nm. At the same time, it has been confirmed that the integrated RDNA2 GPU unit and the DDR5/PCIe 5.0 controller have an advanced low-power architecture design.
In addition, the second-level cache (per core) of the Zen 4 processor has been increased to 1MB, doubling that of the previous generation; the single-thread performance has been increased by over 15%, the maximum acceleration frequency has exceeded 5GHz, and the AI acceleration instruction set has been expanded.
In fact, a lot of the above information has been confirmed in previous revelations. It is expected that the first batch of Zen 4 processors announced by AMD will have at least four models, namely Ryzen 9 7950X, Ryzen 9 7900X, Ryzen 7 7800X, Ryzen 5 7600X, of which 7950X is 24 cores and 48 threads or 16 cores and 32 threads, the power consumption benchmark is 105W, the maximum is 170W, and the maximum acceleration frequency can reach 5.4GHz.
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