Today’s life taste chip destination is the OPC (Optical Proximity Correction) process, a delicate cutting restaurant that corrects the fit so that the semiconductor circuit pattern can be perfectly implemented on the wafer.
Semiconductor processing deals with microscopic design patterns on the nanometer scale. A nanometer is the size of a human hair divided 100,000 times. When such a fine design pattern is actually implemented on a wafer, there is inevitably a difference due to physical and chemical limitations that occur during the process.
The OPC process is where these limitations are overcome and circuit patterns can be implemented directly on the wafer. It predicts the phenomena and distortions that may occur during the process of the designed circuit pattern in advance, calculates the value to be deformed in advance, and goes through ‘correction’ work that breaks the circuit pattern into small pieces to get the correct fit for each part. It is also characteristic of the OPC process that it is possible to know in advance what will happen in every area of the wafer.
The more you know, the more curious you are here! Let’s hear the story of the OPC process through Kang-Min Jung, an expert who has been involved in the OPC process for over 10 years.